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Bring multiple test interfaces into one modular platform

The BIM 3.1 – Bus Interface Modular Box is a configurable platform designed to integrate multiple communication, switching and measurement functions into a single test system.

With capacity for up to 15 interchangeable modules, it can combine communication interfaces and converters, DUT power and measurement, relay switching, DMM measurement and load simulation within one scalable architecture.

  • Up to 15 configurable module slots
  • Modular and scalable architecture for different test requirements
  • TCP/IP communication with LabVIEW™, TestStand and C# API support
BIMP 3.1

Build the test interface around your application

The BIM 3.1 combines communication, switching and measurement functions in one modular platform, with up to 15 configurable slots for different DUTs and test requirements.

Its TCP/IP-based architecture supports flexible integration in rack or benchtop systems, with compatibility for LabVIEW™, TestStand and C# APIs across applications such as radar, LiDAR, infotainment and optical testing.

BIM 3.1 in detail